Jobs at onsemi | HiringCafe

onsemi

Customer Service Representative

Understanding of supply chain management, customer service, data analysis, problem-solving, multi-tasking, interpersonal and English communication skills.

Senior Principle Engineer - Test

Principal Engineer - Test

15+ years in semiconductor test development or sustaining; 5+ years in leadership; test cell/operation flow knowledge; VDA 6.3 a plus; proficient English; able to coordinate with multinational teams.

FA Technician

Bachelor’s degree or higher (Electrical Engineering preferred); strong problem solving; lab experience with small samples and chemicals; good English; teamwork and organizational skills.

Staff Engineer, External Manufacturing Engineering

Bachelor’s degree in engineering; 12+ years in semiconductor assembly with Process or Quality Engineering focus; willingness to work onsite; strong problem-solving and English communication; VDA 6.3 or IATF16949 preferred.

Oracle Visual Builder / Oracle Integration Cloud Developer

Bachelor’s degree in Computer Science, Information Systems, or Engineering; 2–5+ years in Oracle ERP development and support; Oracle Fusion Cloud, OIC integrations, UI with Visual Builder.

MTS, DIGITAL; DSGN

Verification Manager

B.Tech/M.Tech in Electrical Engineering; 12+ years VLSI verification; strong leadership; mixed-signal verification; embedded CPUs; signal processing verification; strong communication.

MGR SR, PROD ENGRG; PROD&TEST

Senior Manager, Production Engineering and Test

B.Tech/M.Tech in Electrical Engg; 12+ yrs pre/post-silicon validation; prototyping/emulation; lab testing; validation automation; leadership; semiconductor product development

Post Fab Wafer Operator Nights

Wafer Operator

High school diploma or GED; no driver license required; 12-hour night shift; ability to lift 15 pounds; cleanroom attire; strong attention to detail; good computer skills; prior semiconductor experience preferred but not required.

ENGR STAFF, PACKAGE DEV; PKG&ASSY

Staff Engineer, Package Development

Bachelor's or Master's in Electronic, Electrical, Microelectronic, or Mechatronic Engineering; 8+ years in process/package development; DOE experience; JMP/Minitab advantage; strong Malay and English communication.

Wire Bond Process Engineer

3+ years in semiconductor manufacturing; 2+ years in wirebond thermosonic bonding; experience with K&S/ASM/Shinkawa UTC platforms; Cu wire experience a plus.

Systems Technician

Diploma in Computer Science related field; 0-2 years in data modeling or MES config; knowledge of CAMSTAR MES; SQL and relational databases; understanding of software validation and change control.

Senior Module Engineering Manager -  Photolithography

Senior Module Engineering Manager

Bachelor’s degree in engineering or technical discipline; 6+ years relevant experience; 3+ years leadership in engineering/manufacturing; English proficiency; US work authorization; background checks.

Manufacturing Probe Test Engineer

BS or MS in EE/CE or solid-state physics; semiconductor device physics; C++ and data analysis; GR&R experience; problem-solving.

Wafer Fab Operator

High school diploma or GED; willingness to work 12-hour compressed shifts; ability to wear cleanroom attire; physical ability to lift 15 lb wafers; basic computer skills.

INTERN (FINANCE)

Finance Intern

Pursuing a Bachelor's in Finance, Accounting, Economics; strong accounting knowledge; Excel proficient; detail-oriented.

MTS, Power Module Design

Power Module Design

Masters in electrical/electronic/mechatronics engineering; 12+ years in power semiconductors/modules; ECAD/MCAD tools; English fluency; senior IC-level individual contributor.

Applications Engineer Director, SiC Products

Applications Engineer Director

BSEE plus 14+ years related experience; 5+ years leading engineering teams; strong product development and SiC knowledge; English communication; leadership/mentoring.

Process Engineer

BS in engineering or technical field; MS a plus; semiconductor processing experience; knowledge of wafer thinning, sputter, plating, photolithography, wafer bonding a plus; cross-functional teamwork; FMEA a plus; data analysis in Excel/JMP; MS Office; strong communication; English fluency.

Sr. MTS, Power Module Design

Masters in Electrical/Electronic/Mechatronics or related field; 15+ years in power semiconductors/electronics; 5+ years in power module design; ECAD/MCAD tools; strong leadership; English fluent; director-equivalent IC role.

Staff Application Engineer, SiC Products

Staff Applications Engineer

Bachelor’s in Electrical Engineering with 5-6 years, or Master’s with 3-4 years, or PhD in power electronics; power module validation experience; strong power electronics knowledge; PCB design, LabVIEW, Python a plus; proficient in SPICE, SIMPLIS/Simetrix, MATLAB; English communication; up to 10% travel.

Senior Technical Marketing Engineer

7+ years in semiconductor industry; automotive product focus; strong power semiconductors knowledge; analytical, proactive, team player; willing to travel domestically and internationally.

Program Manager for New Product Development (NPD)

Program Manager

10+ years in semiconductor or 5+ years in PM; PMP desirable; knowledge of silicon wafer fab and power devices; NPD process with MS Project/Agile PLM; strong English; BS in engineering.

New Product Development Technical Lead - JFET

New Product Development Technical Lead

Master’s degree in Electrical Engineering or Materials Science; 10+ years in power semiconductor product development (SiC preferred); strong knowledge of power devices, packaging, reliability; proven cross‑functional leadership.

Capacity Planner (Front-End)

BS/MS in Business, Industrial Engineering, or Supply Chain; 3-5 years in semiconductor; English fluency; SQL a plus.

Module Technician-Night Shift

Module Technician

High School Diploma or equivalent; technical certification or associate degree preferred; strong troubleshooting; reading schematics; night shift availability.

Wire Bond Engineer (Ultrasonic)

Wire Bond Engineer

Education: BS in Engineering; 3+ yrs in semiconductor manufacturing with ≥2 yrs in wirebond ultrasonic bonding; experience with Orthodyne, KnS Power Fusion; DOE/ SPC/ PFMEA; strong communication.

ENGR STAFF, PROCESS; PKG&ASSY

Staff Engineer, Process - Package & Assembly

8+ years in package development for power module packages; BS/MS; English fluency; JMP/Minitab, AutoCAD, MS Office; self-motivated and independent.

Accountant

Bachelor’s degree in Accountancy, 5 years accounting exp (GL/month-end), Oracle Fusion exp preferred, strong Excel, multitasking capacity.

Principal Engineer

Engineer

Masters in Electrical Engineering with semiconductor device physics; TCAD and device simulation; 3D EM/analog RF tools; BJT/SCR/diode measurements; flip-chip/wire-bond packaging knowledge; strong communication and leadership.

Associate, Customer Service Agent

Customer Service Agent

Bachelor’s degree; knowledge of semiconductor processes a plus; willing to work night/rotating shifts; strong communication; Salesforce knowledge a plus.

Field Sales Engineer (ELT)

0.5-1.5 years in business development/sales/marketing/FAE; power semiconductor experience a plus; bachelors in Electronic Engineering or related field preferred.

Field Sales Engineer

0.5-1.5 years in business development, sales, marketing, or FAE preferred; power semiconductor experience a plus; bachelor’s degree in Electronic Engineering or equivalent preferred.

0.5-1.5 years in BD, sales, marketing or FAE; power semiconductor experience; BS in Electronic Engineering or equivalent.

Tactical Planner

3+ years in supply chain planning; BS in SCM or related field; detail-oriented; analytical; able to handle fast-changing environment.

0.5–1.5 years in business development, sales, marketing or FAE preferred; Power Semiconductor experience a plus; Bachelor's degree in Electronic Engineering or equivalent preferred.

Request for Factory Automation Engineer New

Factory Automation Engineer

Bachelor’s or Master’s in Mechanical, Electrical, Mechatronics, Automation Engineering; 2–5 years automation experience; CAD tools or PLC/C# programming; Lean Manufacturing experience; strong communication; English proficiency; self-driven; minimal supervision.

Manufacturing Supervisor (Planning)

Manufacturing Supervisor

Bachelor’s degree in Engineering; 2-3 years supervisory experience in manufacturing; knowledge of MES, SOPs, and quality processes.

SR ACCOUNTANT SPECIALIST

Accountant Specialist

Bachelor’s in Accounting or related field; 2-5 years AP experience; Oracle knowledge beneficial; proficient with Windows tools; strong communication, organizational and problem-solving skills; able to work independently or in a team; willing to work in Alabang, Muntinlupa.

Learning & Development Business Partner

Bachelor’s degree in HR/Organizational Development; 5+ years in HR, L&D, or business partnering; strong stakeholder management and facilitation skills.

Sr. Product Engineer (PSG)

Sr. Product Engineer

BSEE/BSECE with 3-5 years in device/product or test engineering in semiconductors; silicon fabrication/testing experience; PM training preferred; strong multi-priority handling; strong communication and collaboration.