Jobs at onsemi | HiringCafe

onsemi

Sr Principal Engineer, NPD Quality and Reliability

Principal Engineer

Bachelor’s or Master’s in Electrical Engineering or related field; 10+ years in a comparable role; device physics knowledge; semiconductor fab and packaging; JMP or similar data analysis tools; JEDEC/AEC/AQG standards knowledge; strong analytical and communication skills; NVM experience a plus.

Senior Post Fab Module Engineer

Bachelor’s or higher in engineering or physics; 10 years in semiconductor back-end processing; strong data analysis and problem-solving skills.

New Product Introduction Engineer

5+ years in package development; power module packaging experience; engineering degree; JMP/Minitab, AutoCAD, MS Office; strong communication and leadership.

Assembly Process Engineer

Bachelor’s degree in engineering with 1+ years industrial/manufacturing experience; experience with JMP/Minitab/Tableau; strong analytical, organizational, and communication skills; ability to work Independently; 10% travel.

Staff Process Engineer - Wirebond

Staff Process Engineer

Bachelor's in Engineering; 10+ years in semiconductor manufacturing with 5+ years in wirebond thermosonic bonding; experience with K&S/ASM/Shinkawa UTC platforms; Cu wire/interconnect experience a plus.

ENGR I, PROCESS; MFG

Process Engineer I

Bachelor’s degree in engineering with 1+ years of industrial/manufacturing experience, or advanced degree with relevant lab experience; experience with JMP, Minitab, Tableau; strong analytical and communication skills; willing to travel 10%.

Assembly Technicians

Assembly Technician

Equipment maintenance, troubleshooting, drawings reading, and process improvement in a manufacturing setting.

High school diploma with 3+ years related experience or advanced degree; mechanical/electrical aptitude; SPC knowledge; MS Office; able to lift 50 lbs; stand/walk 12 hours; English proficiency; flexible shifts

GaN/BCD/Power Device Process Integration Engineer

MS or PhD in Electrical Engineering, Physics, or Material Science; deep GaN/BCD power device knowledge; experience with foundries; strong English communication and project management.

Project Manager - Supply Chain

Project Manager

Bachelors in Operations/SCM; 3-5 years experience coordinating with multiple stakeholders.

SENIOR PRODUCTION PLANNER/SCHEDULER

Production Planner/Scheduler

Bachelor in Industrial Engineering; 2-3 years materials/production planning; semiconductor process experience; MS Office; strong presentation and problem-solving; able to work under pressure.

Process Engineer

Bachelor’s degree in engineering; experience with JMP/Minitab/Tableau preferred; strong analytical and communication skills; able to work independently in a manufacturing environment.

Probe Manufacturing Technician

3-year electronics/technology course; 3+ years in test platforms (Teradyne M/IFLEX, Advantest T2000, ETS 800/364); electronics circuit analysis; read schematics; strong problem solving; team player; able to work independently.

Assembly Manufacturing Technician

Minimum 3 years as Maintenance Technician in semiconductor; associates degree or 2-year tech course; hydraulics, servomotors, pumps, sensors, PLC; read electrical/electronics diagrams; preventive maintenance; good communication.

Senior Design Verification Engineer

Design Verification Engineer

BS/MS in Electrical Engineering or related field; 3+ years in digital verification; strong knowledge of UVM, constrained random verification, assertion-based verification, and coverage strategies; excellent English communication.

Senior Digital Design Engineer

BS/MS in Electrical Engineering; 5 years ultra-low-power digital design with Verilog/SystemVerilog; system-level thinking; strong communication; desirable Verilog-A/VHDL-AMS; embedded CPUs; AMBA; ADC/DAC/PLL; Python/C; RTL to GDS; UVM; Functional Safety.

BS/MS in Electrical Engineering or related field; 5+ years in ultra-low-power digital design using Verilog/SystemVerilog; system-level thinking and technical leadership; strong English communication.

Senior DFT Engineer

3–5 years ASIC/SoC DFT experience; strong knowledge of Scan, ATPG, MBIST, JTAG; experience with DFT tools; familiarity with timing, CDC, and low-power DFT flows; BS/MS in Electrical Engineering or related field.

Wire Bond Technician

Responsible for wire bonding and FOL die bond; setup, troubleshoot, and provide line support; 2-3 years in semiconductor assembly.

Process Operator

High school or vocational education; 18+; Vietnamese with basic English; willing to learn; team player; disciplined.

FE Process Technician

Troubleshoot electrical/mechanical components, apply continuous improvement, plan and coordinate with operators/engineers, read drawings, understand safety policies.

Test Manufacturing Technician

Associate degree in electronics/technology; 3+ years in semiconductor test platforms; circuit analysis and schematic interpretation skills; problem solving; teamwork; able to work independently.

ENGR SR, PRODUCT; PROD & TEST

Senior Engineer, Product and Test

Bachelor or master's degree in Electronics/Electrical or related discipline; 5+ years in bench validation/characterization of analog and digital blocks; experience with JMP/Datapower-like tools; CMOS image sensors a plus; knowledge of silicon bring-up and lab equipment; programming in C, VB, Python.

CMP Equipment Engineer

Bachelor’s degree in Chemical Engineering, Materials Science, Electrical Engineering, or related field; 5+ years semiconductor experience with CMP exposure; knowledge of CMP fundamentals; experience with SPC tools and data analysis; exposure to CMP equipment.

External Manufacturing Engineer

Bachelor's in Engineering or related technical background; 5–8 years in semiconductor IC manufacturing; hands-on exposure to Wafer Bump, Assembly/Test, and Packaging; cross-site program management and leadership; PMP certification an advantage.

Manufacturing Technician

Graduate of technical courses; basic electronics and MS Office; knowledge in testing/troubleshooting; experience with semiconductor probe/KGD/AOI/TnR is an advantage; strong communication, multitasking and time management; familiarity with various test/handler/AOI platforms

151 Semiconductor Components Industries, LLC

Process Integration Engineer

MS or PhD in Electrical Engineering, Physics, Chemistry, Chemical Engineering, Materials Engineering, or related technical field. Experience with semiconductor process technology and wafer fabrication. Understanding of semiconductor device physics (CMOS, DMOS, Bipolar, Trench FET). DOE/data analytics experience; strong communication and collaboration.

Failure Analysis Laboratory Operator

High school/technical graduate; 2+ years semiconductor manufacturing experience; analytical/problem-solving skills; hands-on failure analysis tools experience; MS Office proficiency.

Sr. Contract Compliance Analyst

Contract Compliance Analyst

Bachelor’s degree in business or related field; 5+ years in procurement/sourcing/contracting/vendor management; strong S2P and pricing knowledge; negotiation skills; ERP experience; certifications.

Program Manager - Product & Process Change Management

Program Manager

Bachelor’s degree; 8+ years in Manufacturing/Quality/PM; cross-functional leadership; English fluency; strong analytics and communication; MS Office; Power BI/Tableau experience

Summer 2026 - LLM Research Intern : Physics-AI-Powered Analysis of Atomistic Systems

LLM Research Intern

PhD student in Electrical, Computer, or Chemical Engineering; enrolled in degree program during internship.

Sr Accountant Specialist

Accountant Specialist

BS/BA in Accountancy or Accounting Technology; 2-5 years Accounts Payable experience; Oracle knowledge a plus; proficient with MS Office; strong communication, organizational, analytical skills; able to work independently or in a team; willing to work in Alabang, Muntinlupa.

Microelectronic System and Packaging Mold Flow Simulation Engineer

Master or PhD in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials; 10-15 yrs in plastics/molds/injection/transfer molding; CAD/SolidWorks; mold flow; ANSYS; Unix/Linux; English; team player.

INTERN - Product Engineer (AMG)

Product Engineer

Currently enrolled in BS Electronics Engineering or Computer Engineering; knowledge of electronics principles and programming languages (C++, Python, Visual Basic, MS Excel Macro).

DIR, OPERATIONS

Director, Operations

More than 10 years manufacturing experience; 5+ years of management; English proficiency for global stakeholders; Lean/Six Sigma knowledge.

Customer Quality Director

Senior quality leader with 10+ years in medical/semiconductor/automotive quality, customer-facing and cross-functional leadership.

Accounting Specialist

BS in Accounting/Finance; CPA or MBA preferred; 0-2+ years accounting/finance experience; Oracle Cloud experience preferred; strong communication; advanced Excel; team player.

PCN Program Manager (Product & Process Change Management)

PCN Program Manager

Bachelor's degree; several years in Manufacturing/Quality Engineering; strong data analytics; cross-functional leadership; English communication; MS Office; Power BI/Tableau.

QFN Tech leader

QFN Tech Leader

8+ years in Semiconductor Package Development; 5+ years with master’s degree; experience in Power Semiconductor packages; strong communication and English; PMP certification preferred.

MFG INDUSTRIAL ENGINEER I

Industrial Engineer I

BS in Industrial Engineering; 0-2 years; fresh graduates welcome; layout analysis, manpower calculations, MMR/OEE/UPH knowledge; Excel proficiency