Jobs at onsemi | HiringCafe

onsemi

Snr Filed Application Engineer

Senior Field Application Engineer

8-10 years in field application engineering; power electronics design; customer support; demand creation and funnel/DWIN planning.

Manufacturing Supervisor (Test)

Manufacturing Supervisor

Bachelor’s degree in engineering; 2-3 years supervisory experience in manufacturing; semiconductor industry preferred.

Probecard Engineer

BS in engineering; 3+ years as Probecard Engineer in semiconductor/manufacturing; strong probecard build/repair/maintenance; analysis; data interpretation; continuous improvement.

MTS Digital Design Engineer

Digital Design Engineer

BS EE with 17+ years or MS with 15+ years; strong RTL/Verilog; ASIC/mixed-signal ICs; power management; leadership and cross-functional communication.

Test Manufacturing Technician

Manufacturing Technician

Associate degree or 3-year technical course; 2+ years equipment/line maintenance in semiconductor/manufacturing; strong electrical knowledge; read schematics; shift schedules.

Product Technician

Diploma/Certificate in Engineering; 5+ years in manufacturing/testing/engineering preferred; strong English; familiar with data tools; good communication; ability to work independently or in a team.

Product & Test Technician (Project Based)

Product & Test Technician

Associate degree or diploma in electronics/engineering; basic knowledge of ATE, handler setup, semiconductor fundamentals; experience in semiconductor manufacturing/test operations preferred; proficient with MS Excel.

Mixed-Signal Verification Engineer – Analog IP

Mixed-Signal Verification Engineer

Bachelor’s or Master’s degree in Electrical Engineering or related field; 6+ years in mixed-signal or digital IC verification; SystemVerilog and UVM proficiency; Verilog-A/AMS modeling; analog IP verification within digital-on-top SoCs.

Accounting Controller

University degree in Accounting/Finance/Economics; 10+ years in finance including 5+ in statutory accounting/audit; ERP proficiency (SAP/Oracle); IFRS and local GAAP knowledge; English fluent; German a plus.

Principal Firmware Engineer, AI Compute Kernels

Firmware Engineer

15+ years firmware development, hardware/software co-design, DMA, memory-mapped I/O, AI framework knowledge, bare-metal C, memory-constrained optimization, strong communication.

Development Reliability Staff Engineer

PhD or MS with 3-5 years experience; strong physics of failure; chip-package interactions; reliability testing; power semiconductors; data analysis and reporting.

ENGR SR, PRODUCT; PROD&TEST

Senior Engineer, Product and Test

BSEE with 5-8 yrs direct Test & DFT design; strong C/C++, Perl, Python skills; excellent communication/leadership; global team collaboration; self-driven; strong organizational skills.

External Manufacturing NPI Engineer

Bachelor's in Engineering or Materials Science; 10+ years in backend semiconductor IC manufacturing; wafer tech and WLP experience; CPI; leadership; data analytics; English proficiency; Mandarin a plus.

ENGR II, RELIABILITY; QUAL&REL

Reliability Engineer

Bachelor's in Electronics, Materials Science/Engineering, Physics, Chemical Engineering; 3-5 years in Reliability/Sustaining Engineering; environmental stress testing; reliability qualification; data analysis; 8D; FMEA; MIL/JECED standards.

ENGR II, PRODUCT; PROD&TEST (NPI ENGR, Final Test)

Engineer II, Product; Production & Test (NPI Engineer, Final Test)

Bachelor’s degree in Electrical/Electronics/Computer/Manufacturing Engineering; 3+ years in semiconductor Final Test/NPI; hands-on NPI qualification; knowledge of Final Test processes; yield analysis/GR&R/root-cause preferred; test program development; strong communication.

System Architect – Power electronics

System Architect

Experience in power electronics systems (AC-DC/DC-DC), SiC/GaN/Si MOSFETs; electrical/thermal modeling; leadership; strong communication; system architecture for high voltage automotive/industrial applications; OEM collaboration.

Power electronics system design, SiC/GaN, ISO 26262, automotive/industrial safety, OEM collaboration, leadership and communication skills.

Staff Product and Test Engineer

BSEE with 5+ yrs in product/test for analog/mixed-signal/digital; experience with ATE; proficient in C/C++, Python, Java; strong communication and leadership; global team collaboration; quick to adapt and manage multiple tasks.

Principal Application Engineer, SiC products

Principal Application Engineer

Bachelor’s/Master’s/PhD in Electrical Engineering; 10+ years experience; SiC product validation; power converter knowledge; SPICE, MATLAB; Python/LabView helpful; English proficiency.

Bachelor's degree in Engineering or Materials Science; 10+ years in backend semiconductor IC manufacturing; strong leadership and PM; NPI and CPI experience; data analytics; English and Mandarin skills.

SiC  Yield Enhancement Engineer

Yield Enhancement Engineer

Bachelor's in Engineering; 5–10 years in semiconductor yield/process, defect engineering; DOE/SPC and data analysis skills; defect analysis and electrical characterization; strong communication and teamwork.

Project/Program Management/​ Business Analyst

8+ years in semiconductor; governance/BE CAB/ATO; project management; stakeholder engagement; data analytics.

Manufacturing Supervisor (FOL)

Bachelor degree in engineering; 2-3 years supervisory experience in manufacturing; 1 year supervisory experience preferred in semiconductor; strong planning and communication skills.

Manufacturing Supervisor (EOL)

Bachelor's degree in engineering; 2-3 years supervisory experience in manufacturing; MES knowledge; planning, analysis, and quality standards experience.

Incoming Quality Assurance DL Inspector

Inspect materials, document COC, read drawings, determine acceptance, maintain logs, ensure safety; proficient in MS Office; good communication; lift 10-15 kg.

Senior Test Application Engineer

BS/MS in EE/CS/CE with 7+ years ATE test automation; experience with Advantest/Teradyne; strong C/C++, Python, Java; DfT; analog/mixed-signal testing; EDA tools; cross-functional leadership.

Customer Service Representative

Understanding of supply chain management, customer service, data analysis, problem-solving, multi-tasking, interpersonal and English communication skills.

Senior Principle Engineer - Test

Principal Engineer - Test

15+ years in semiconductor test development or sustaining; 5+ years in leadership; test cell/operation flow knowledge; VDA 6.3 a plus; proficient English; able to coordinate with multinational teams.

FA Technician

Bachelor’s degree or higher (Electrical Engineering preferred); strong problem solving; lab experience with small samples and chemicals; good English; teamwork and organizational skills.

HR Project Specialist

Experience with HR information systems, HR processes and lifecycle, HR operations/project coordination, strong data analytics, MS Excel/Office, and English at least B2.

Staff Engineer, External Manufacturing Engineering

Bachelor’s degree in engineering; 12+ years in semiconductor assembly with Process or Quality Engineering focus; willingness to work onsite; strong problem-solving and English communication; VDA 6.3 or IATF16949 preferred.

Oracle Visual Builder / Oracle Integration Cloud Developer

Bachelor’s degree in Computer Science, Information Systems, or Engineering; 2–5+ years in Oracle ERP development and support; Oracle Fusion Cloud, OIC integrations, UI with Visual Builder.

MTS, DIGITAL; DSGN

Verification Manager

B.Tech/M.Tech in Electrical Engineering; 12+ years VLSI verification; strong leadership; mixed-signal verification; embedded CPUs; signal processing verification; strong communication.

MGR SR, PROD ENGRG; PROD&TEST

Senior Manager, Production Engineering and Test

B.Tech/M.Tech in Electrical Engg; 12+ yrs pre/post-silicon validation; prototyping/emulation; lab testing; validation automation; leadership; semiconductor product development

Post Fab Wafer Operator Nights

Wafer Operator

High school diploma or GED; no driver license required; 12-hour night shift; ability to lift 15 pounds; cleanroom attire; strong attention to detail; good computer skills; prior semiconductor experience preferred but not required.

ENGR STAFF, PACKAGE DEV; PKG&ASSY

Staff Engineer, Package Development

Bachelor's or Master's in Electronic, Electrical, Microelectronic, or Mechatronic Engineering; 8+ years in process/package development; DOE experience; JMP/Minitab advantage; strong Malay and English communication.

Wire Bond Process Engineer

3+ years in semiconductor manufacturing; 2+ years in wirebond thermosonic bonding; experience with K&S/ASM/Shinkawa UTC platforms; Cu wire experience a plus.

Systems Technician

Diploma in Computer Science related field; 0-2 years in data modeling or MES config; knowledge of CAMSTAR MES; SQL and relational databases; understanding of software validation and change control.

Senior Module Engineering Manager -  Photolithography

Senior Module Engineering Manager

Bachelor’s degree in engineering or technical discipline; 6+ years relevant experience; 3+ years leadership in engineering/manufacturing; English proficiency; US work authorization; background checks.

Manufacturing Probe Test Engineer

BS or MS in EE/CE or solid-state physics; semiconductor device physics; C++ and data analysis; GR&R experience; problem-solving.