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Package Development Assembly Process Engineer Jobs in United States

4 package development assembly process engineer jobs from 4 companies hiring in United States.

4 jobs- United States
1w
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Principal Assembly Process Development Engineer
Andover, Massachusetts, United States
$108k-$205k/yr OnsiteFull Time
RTX
RTXNYSE: RTX: RTX provides advanced aerospace and defense systems and services.
8+ YOEBachelor's in STEM; 8+ years in semiconductor packaging; ability to obtain/maintain US DoD Secret clearance.
2D CAD, wire bonding, die attachment, solder reflow, bonding equipment, SMT tooling, screen printers, automated dispensing tools
2mo
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Senior Photonics Process Development Engineer Packaging and Tooling
San Diego, California, United States
$125k-$175k/yr OnsiteFull Time
Monarch Quantum
Monarch Quantum: Building integrated photonics systems for quantum computing and sensing.
5+ YOE5+ years in photonics/process development; BS or MS in engineering or physics; experience with packaging/assembly equipment; export-controlled information access.
Vacuum reflow soldering, Wire bonding, Die bonding, Active alignment equipment, Laser welding systems, Hermetic sealing equipment, Process metrology equipment, Inspection and testing tools, Automation and semi-automation equipment
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Staff Equipment Development Engineer - Advanced Packaging
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
2+ YOEMaster’s degree plus 2+ years semiconductor equipment/process experience; DOE/SPC; root-cause/problem solving; hands-on with wafer/assembly tools; travel.
DOE, SPC, Failure analysis, 8D, Data analysis, Wafer processing tools, Assembly tools, Overlay systems, FMEA
4d
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Manufacturing Engineer
Fremont, California, United States
$94k-$130k/yr OnsiteFull Time
Amphenol Advanced Sensors
Amphenol Advanced SensorsNYSE: APH: Designs and manufactures advanced sensing and measurement technologies.
3+ YOEBS in Materials/Electrical/Mechanical Engineering; 3+ years in semiconductor or sensor packaging/process development; 2+ years hands-on packaging/assembly; experience with die attach, wire bonding, flip-chip, molding/encapsulation, soldering, failure analysis; strong DOE and statistical skills; experience documenting processes and PPAP/APQP for aut...
Minitab, JMP, Excel, Wire bonders, Flip-chip bonders, Die bonders, Reflow ovens, Mold presses, Plasma cleaning tools, Pick-and-place, X-ray/CT, SEM, C-SAM, Environmental chambers

HiringCafe market data

Package Development Assembly Process Engineer Jobs market signals in United States

These signals come from live HiringCafe job inventory, not a static article. Use them to compare the market, then open listings above to apply directly.

Open jobs
4
Hiring companies
4
Fresh sample
75% new in 30d
Salary visibility
75% show pay

Companies appearing in this market

Amphenol Advanced SensorsMicron TechnologyMonarch QuantumRTX

Work location mix in visible results

Onsite: 4