- Maintaining and support the Production Software tools, Oracle and PCs.
- Spearhead of continuous improvement projects to improve yield, reduction of production labor hours and end-to-end quality
- Drive programs to develop supplier and/ or in-house manufacturing processes, quality systems, continuous improvement systems to achieve problem resolution.
- Coordinate with design engineering to improve the design concept, simplify manufacturability and product bonding process tests.
- Develop test procedures, test equipment and data collection methods for wirebonder equipment production.
- Development of Manufacturing Test Plans / Standard Operating Procedures to ensure Built to Quality for Semiconductors Wire Bonder Machines
- Identify, diagnose and resolve assembly process related problems to achieve defined First Pass Yield, Productivity and Target Throughput
- Ensure and validate all necessary fixtures, jigs, drawings, and work instruction are available for manufacturing processes
- Monitoring of Manufacturing Processes with Statistical Process Control
- Training and Skillset Profiling for Manufacturing Technicians
Responsibilities
- Maintaining and support the Production Software tools, Oracle and PCs.
- Spearhead of continuous improvement projects to improve yield, reduction of production labor hours and end-to-end quality
- Drive programs to develop supplier and/ or in-house manufacturing processes, quality systems, continuous improvement systems to achieve problem resolution.
- Coordinate with design engineering to improve the design concept, simplify manufacturability and product bonding process tests.
- Develop test procedures, test equipment and data collection methods for wirebonder equipment production.
- Development of Manufacturing Test Plans / Standard Operating Procedures to ensure Built to Quality for Semiconductors Wire Bonder Machines
- Identify, diagnose and resolve assembly process related problems to achieve defined First Pass Yield, Productivity and Target Throughput
- Ensure and validate all necessary fixtures, jigs, drawings, and work instruction are available for manufacturing processes
- Monitoring of Manufacturing Processes with Statistical Process Control
- Training and Skillset Profiling for Manufacturing Technicians
Qualifications
- Degree / Master in Engineering Disciplines (Mechanical / Mechatronics) or equivalent
- Min 5-7 years' relevant experience in the semiconductor wire bonder manufacturing environment especially in the Low Volume and High Mix manufacturing model
- Strong analytical and problem solving skills
- Strong understanding of bonding failure modes and defect analysis.
- Mechanical design & assembly process knowledge of semiconductor wire bonding equipment
- Advanced knowledge of high precision electro-mechanical components and systems
- Proficiency in statistical tools (JMP, Minitab), SPC, and problem-solving methodologies (8D, DMAIC) is an advantage.
- Knowledge of bonded wire measurement equipment is an advantage.
- Effective verbal and written communication skills, with a positive attitude and an open mindset to embrace a team-oriented working environment.
Company Overview
Founded in 1951, Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) specialize in developing cutting-edge semiconductor and electronics assembly solutions enabling a smarter and more sustainable future. Ever-growing range of products and services supports growth and facilitates technology transitions across large-scale markets.
Please refer to the website for more details: www.kns.com.
Equal Opportunity
Kulicke & Soffa recruits on the basis of merit (such as skills, experience or ability to perform the job), regardless of age, race, gender, religion, marital status and family responsibilities, or disability.