Purpose of the positionEducation and work experience
Working conditions
Foxconn Technology Group, a global leader in electronics manufacturing, is seeking a Failure Analysis Engineer to lead root cause investigations and drive process optimization. Once a part of the team you will have opportunity to lead real-time yield monitoring and rapid anomaly resolution to maintain target performance; drive dynamic analysis of defective main logic board to build troubleshooting expertise and streamline diagnostics; compile and deliver product analysis and yield reports to inform decision-making; and mentor new engineers and technicians to enhance team technical capability.
Duties and Responsibilities1. Track production yield in real time, analyze trends weekly/monthly, and flag critical anomalies for leadership review.
2. Diagnose main logic board defects using advanced tools (oscilloscopes, spectrum analyzers, etc.) to identify root causes and train engineers/technicians on troubleshooting.
3. Respond immediately to yield deviations, lead Root Cause Analysis, and implement Corrective & Preventive Actions to resolve issues.
4. Adhere to company policies and Standard Operating Procedures for quality inspections to ensure consistent, standards-based processes.
5. Deliver weekly yield reports and present monthly trends/anomalies to stakeholders for strategic decision-making.
6. Identify process risks through continuous yield monitoring and recommend improvements to strengthen quality outcomes.
2. Diagnose main logic board defects using advanced tools (oscilloscopes, spectrum analyzers, etc.) to identify root causes and train engineers/technicians on troubleshooting.
3. Respond immediately to yield deviations, lead Root Cause Analysis, and implement Corrective & Preventive Actions to resolve issues.
4. Adhere to company policies and Standard Operating Procedures for quality inspections to ensure consistent, standards-based processes.
5. Deliver weekly yield reports and present monthly trends/anomalies to stakeholders for strategic decision-making.
6. Identify process risks through continuous yield monitoring and recommend improvements to strengthen quality outcomes.
1.Successful completion of 4-years of high school, or equivalent, plus completion of 4 years of college with a bachelor’s degree, plus attainment of a master’s degree. Degree required: Electronic information engineering
2. 3 to 5 years of work experience in failure analysis within Computer, Communication, and Consumer Electronics sectors.
2. 3 to 5 years of work experience in failure analysis within Computer, Communication, and Consumer Electronics sectors.
Working conditions
- Modern, collaborative offices or labs with flexible setups emphasizing innovation and teamwork.
- Employees are continuously encouraged to learn and grow their careers in smart manufacturing.
- Proficiency in circuit architecture, testing principles, chip functionality, component specifications, and circuit design principles.
- Proficient with diagnostics instrumentation (oscilloscopes, multimeters, spectrum analyzers) to troubleshoot hardware issues and analyze faults.
- Analytical problem-solving and clear communication skills to craft technical reports and deliver actionable insights to teams and clients
- Proficient in English; working knowledge of Mandarin is preferred but not required. Proficiency in Spanish is a plus.