MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 65 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

MACOM is an Equal Opportunity Employer

We consider applicants for all positions without regard to race, color, religion, creed, gender, national origin, age, disability, marital status or veteran status or any other legally protected status

Senior Process Engineer – OSAT Back‑End Wafer Operations

The Senior Process Engineer – OSAT Back‑End Wafer Operations is responsible for the technical ownership, optimization, and sustainment of back‑end wafer processes supporting high‑volume assembly and test manufacturing. This role plays a key part in delivering stable yields, robust processes, and cost‑effective operations across multiple customers, device technologies, and wafer platforms.

The position requires deep hands‑on expertise in back‑end wafer processing, strong analytical problem‑solving skills, and the ability to interface directly with subcontractors and cross‑functional teams.

Key Responsibilities

Process Ownership & Manufacturing Support

• Own and sustain back‑end wafer processes, including but not limited to:
• Wafer thinning (coarse and fine grinding)
• Stress relief processes (e.g., SRE, polishing)
• UV tape lamination, debond, and release
• Wafer cleaning and backside inspection
• Wafer dicing
• Die pick and place
• Wafer bumping at our qualified OSATs:
• Ensure bump mask design conforms to published design guidelines
• Bump plating and solder reflow
• Flip-Chip Assembly:
• Manage assembly qualifications
• Sustain the production line at our OSATs
• Ensure processes meet yield, quality, cost, and cycle‑time targets in a volume OSAT environment
• Provide real‑time engineering support for manufacturing excursions and line issues

Yield Improvement & Problem Solving

• Lead root cause analysis for yield loss, die crack, chipping, and handling‑related defects
• Apply structured problem‑solving methodologies (SPC, 8D, DOE, FMEA)
• Define and optimize process windows, control limits, and guard‑banding for fragile or thin wafers
• Drive continuous improvement initiatives to improve yield, reliability, and throughput

Customer & Cross‑Functional Interface

• Act as technical point‑of‑contact on wafer back‑end process topics
• Support customer technical reviews, audits, and failure analysis discussions
• Collaborate closely with Quality, Product Engineering, and Test Engineering teams
• Support new product introductions (NPI), technology transfers, and product qualifications

Equipment, Materials & Technology

• Support evaluation, qualification, and ramp‑up of new equipment, consumables, and materials
• Support standardization and best‑practice sharing across tools, lines, or sites

Documentation & Mentorship

• Work with subcontractors and suppliers to develop and maintain process documentation, SOPs, control plans, and specifications
• Define process monitoring strategies and inline controls
• Support compliance to internal quality systems and customer requirements
• Mentor junior engineers and technicians, providing technical guidance and coaching

Required Qualifications

• Bachelor’s degree in Electrical, Mechanical, Chemical, Materials Engineering, or related discipline
• Minimum 7–10 years of semiconductor manufacturing experience, with strong focus on OSAT back‑end wafer operations
• Demonstrated hands‑on experience in wafer thinning and wafer handling processes
• Strong understanding of wafer mechanics, stress, and fracture risk drivers
• Proven experience supporting high‑volume production and customer‑facing technical issues

Preferred Qualifications & Skills

• OSAT experience supporting multiple customers and device technologies
• Experience with:
• Thin wafers (<150 µm)
• Brittle materials (e.g., GaAs, SiGe, RF or power devices)
• Strong data analysis skills using tools such as JMP, Minitab, Excel, or Power BI
• Familiarity with inline inspection techniques (optical, IR, SWIR)
• Knowledge of ISO 9001 / IATF 16949 or similar quality systems
• Clear technical communication and presentation skills
• Lean/Six-sigma Green Belt Certification.

Key Competencies

• Deep process and manufacturing discipline
• Data‑driven, analytical problem solving
• Strong ownership mindset and accountability
• Ability to operate independently in a fast‑paced factory environment
• Effective cross‑functional and customer communication