About the Team

Infleqtion is commercializing quantum technology—building deployable systems where photonics is the engine for performance, scale, and reliability. Our photonics team develops photonic integrated circuits (PICs) and related optical subsystems that enable chip-scale laser sources, modulation, routing, and control for next-generation quantum products. We work closely with quantum system teams, and external foundry/assembly partners to turn ambitious optical performance targets into manufacturable hardware.

About the Role

Infleqtion is seeking a Senior Laser & Nonlinear Photonics Engineer to lead and execute system-level photonics experiments, with a focus on laser sources and/or nonlinear optics modules (e.g., frequency conversion, parametric processes, comb generation), and their integration into larger photonic and quantum subsystems.

In this role, you will take end-to-end ownership of experimental development: architecture trades, optical design, hands-on build, stabilization/control, measurement automation, performance characterization, and iteration toward reliable prototypes.

We are looking for a highly motivated individual who thrives in ambiguity, enjoys working in a small, dynamic team environment, and has a passion for solving challenging problems that lead to high-impact technological advances.

How you will drive impact

• Architect, build, and validate laser and nonlinear photonics subsystems that meet demanding specs (linewidth, frequency noise, RIN, power, stability, efficiency, SWaP, reliability).
• Develop and run system-level experiments: optical bench builds, fiber-based architectures, free-space coupling, high-speed modulation, and precision frequency control.
• Implement stabilization and control: frequency locks, servo design, modulation/demodulation schemes, and long-term drift mitigation.
• Create robust measurement pipelines (automation, calibration, data analysis) to accelerate iteration and improve reproducibility.
• Translate experimental learnings into engineering requirements for packaging, manufacturability, and productization; collaborate closely with PIC designers, electronics, packaging, and manufacturing partners.