Posted 3mo ago

Failure Analysis Engineer

@ NXP Semiconductors
Kuala Lumpur, Kuala Lumpur, Malaysia
OnsiteFull Time
Responsibilities:perform analysis, analyze devices, document results
Requirements Summary:Bachelor, Master’s, or Doctorate in Electrical Engineering, Materials Science, or Physics; 3+ years semiconductor failure analysis experience; strong device physics knowledge; experience with FA tools; good problem solving and communication.
Technical Tools Mentioned:SEM/EDX, OBIRCH, Emission microscopy, PEM, LIT, OBIRCH, LVP/EOP, curve tracing, oscilloscopes, Statistical analysis tools
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Job Description

Job Summary
As a Failure Analysis Engineer at NXP Semiconductors, you will play a crucial role in ensuring the quality and reliability of our cutting-edge semiconductor products. You will be responsible for investigating and identifying the root causes of device failures, contributing directly to product improvement and customer satisfaction.

Job Responsibilities


* Perform detailed electrical failure analysis on advanced semiconductor devices, including microcontrollers, processors, and analog circuits.
* Utilize a wide range of analytical techniques and equipment, such as SEM/EDX, OBIRCH, emission microscopy, and various electrical fault isolation debug tools.
* Develop and implement new failure analysis methodologies and techniques to address emerging technologies and failure modes.
* Collaborate closely with design, product, test, and reliability engineering teams to provide timely and accurate failure analysis reports and corrective actions.
* Document analysis results thoroughly, including detailed observations, conclusions, and recommended solutions.
* Participate in cross-functional teams to drive continuous improvement in product quality, manufacturing processes, and design.
* Provide technical expertise and mentorship to junior engineers and technicians.
* Stay up-to-date with the latest advancements in failure analysis technologies and semiconductor device physics.

Job Qualifications

* Bachelor, Master's or Ph.D. in Electrical Engineering, Materials Science, Physics, or a related field.
* Proven experience (3+ years) in semiconductor failure analysis within a high-volume manufacturing or R&D environment.
* Strong theoretical and practical knowledge of semiconductor device physics, processing, and packaging technologies.
* Hands-on experience with a broad range of failure analysis tools and techniques (SEM/EDX, PEM, LIT, OBIRCH, LVP/EOP, etc.).
* Proficiency in electrical debug and characterization techniques, including curve tracing, logic analysis, and oscilloscopes.
* Excellent problem-solving skills and a methodical approach to root cause analysis.
* Strong communication skills, both written and verbal, with the ability to present complex technical information clearly and concisely.
* Ability to work effectively in a collaborative, fast-paced environment.
* Experience with statistical analysis tools and methodologies is a plus.


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