Flexcompute is an early-stage technology startup that develops ultra-fast simulation technology to help companies to design and optimize technology products. Our award-winning products are used to design airplanes, wind turbines, quantum computing chips, VR/AR headsets, data centers, and smartphones. Our team consists of world-renowned experts in scientific computing, and we have a global team working remotely from Europe, Asia, North and South America.

The Mission

The semiconductor industry is hitting a “thermal wall.” As chip power densities exceed 1000W, traditional design cycles are too slow to keep up. Flexcompute is looking for a visionary Lead to spearhead our entry into the chip cooling industry. You will use our proprietary, high-performance physics simulation technology to help customers design the next generation of liquid cooling, immersion systems, and advanced heat sinks for AI and HPC hardware.

Key Responsibilities

• Strategy & Product Roadmap: Define how Flexcompute’s solver technology can be optimized for thermal management, including microfluidics, phase-change materials, and 3D IC packaging.
• Technical Leadership: Act as the primary subject matter expert (SME) for chip cooling, bridging the gap between our internal solver developers and external hardware architects.
• Solution Architecting: Work directly with Tier 1 semiconductor companies and Hyperscalers to solve complex thermal challenges using Flexcompute’s simulation platform.
• Market Evangelism: Demonstrate the superiority of our fast-cycle simulation over legacy CFD tools to industry leaders at Nvidia, Intel, TSMC, and cooling specialists.
• Team Building: Eventually recruit and mentor a team of thermal application engineers to support our growing portfolio in the semiconductor space.