Posted 3mo ago

Mechanical Packaging Engineer

@ Avicena
Sunnyvale, California, United States
OnsiteFull Time
Responsibilities:Design packaging, Collaborate manufacturing, Document flow
Requirements Summary:Bachelor’s in Mechanical Engineering with 3+ years in semiconductor packaging; proficient in CAD and thermal/structural analysis.
Technical Tools Mentioned:SolidWorks, SolidWorks Visualize, ANSYS, DFM, DFMA, JEDEC standards, Microsoft Office
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Job Description

About the role:

This position involves developing and supporting mechanical designs for advanced packaging & optical components and systems. The mechanical engineer will collaborate closely with cross-functional engineering teams to capture product concepts, document component, and process flows, and perform analytical studies on material and packaging design that meets final product requirements.

Responsibilities:

  • Design and develop advanced packaging solutions using CAD tools (primarily SolidWorks), including detailed 3D models and 2D engineering drawings that meet industry standards and internal guidelines.
  • Collaborate closely with manufacturing and operations teams to ensure successful implementation of packaging designs, providing hands-on engineering support during production ramp and issue resolution.
  • Document component flow across assembly, test, and packaging processes to support design decisions and manufacturing readiness.
  • Support material and package selection, including epoxies, mechanical housings, and other structural components, with consideration for performance, reliability, and manufacturability.
  • Perform mechanical analyses such as thermal, structural, strain, and root-sum-square (RSS) tolerance analysis to ensure robustness and reliability of package designs.
  • Create clear visualizations and renderings for design reviews, technical discussions, and stakeholder presentations.
  • Contribute to continuous improvement of engineering documentation, design standards, and development workflows.

Qualifications:

  • Bachelor’s degree in Mechanical Engineering, Materials Engineering, or a related field, with 3+ years of experience in semiconductor advanced packaging and design.
  • Strong proficiency in SolidWorks for 3D modeling and 2D drafting; experience with SolidWorks Visualize or similar rendering tools preferred.
  • Solid understanding of mechanical design principles, materials behavior, and design for assembly and manufacturability (DFM/DFA).
  • Experience performing thermal and structural analyses; familiarity with Ansys or equivalent multiphysics simulation tools is a plus.
  • Working knowledge of JEDEC and other relevant packaging standards.
  • Strong understanding of packaging materials, manufacturing processes, and quality/regulatory requirements.
  • Proficient in Microsoft Office tools for documentation, reporting, and presentations.
  • Excellent communication, documentation, and cross-functional collaboration skills.
  • Proven ability to manage multiple projects, work independently, and meet deadlines in a fast-paced environment.
  • Strong analytical thinking and problem-solving skills.