Are you passionate about solving complex thermal challenges in advanced semiconductor technologies? At Falcomm, we are transforming innovative semiconductor research into real-world solutions through high-performance, energy-efficient RF power amplifier technologies. Our mission is to deliver next-generation wireless solutions that maximize performance while improving efficiency and reliability.

Falcomm is seeking an RFIC Thermal Engineer to analyze, model, and optimize thermal performance in RF integrated circuits and semiconductor packages. This role will focus on understanding heat dissipation, thermal reliability, and thermal management strategies for high-power RF devices. The position requires collaboration with RFIC designers, packaging engineers, and system teams to ensure devices operate reliably under demanding performance conditions.

Responsibilities:

• Develop thermal models for RFIC devices, packages, and modules to evaluate heat dissipation and temperature distribution.

• Perform thermal simulations and analysis to support design optimization and reliability improvements.
• Collaborate with RFIC design and packaging teams to develop thermal management strategies.
• Evaluate thermal performance across different packaging technologies and materials.
• Support silicon validation and characterization related to thermal performance.
• Analyze thermal failure mechanisms and recommend design or process improvements.
• Document analysis methods, results, and recommendations.