Explore 4 junior python developer jobs from 3 hiring companies in Depoe Bay, OR, US. Filter by remote, salary, experience, and company, then open any listing to apply.

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Junior Python Developer Jobs

Intel

Andrews Cooper

Onsite

Hybrid

<h1>Job Details:</h1><h2>Job Description:&nbsp;</h2>Who We Are Join Intel’s Core Engineering team—the group responsible for building the world’s most advanced CPU architectures. Our engineers turn breakthrough ideas into the silicon powering personal devices, cloud datacenters, AI platforms, and emerging edge technologies. If you&#39;re excited about working close to the hardware and shaping the next generation of Intel processors, this is the place for you.What You’ll DoAs a Junior CPU Design Verification Engineer, you will contribute to the development and validation of Intel’s next‑generation CPU designs. You will work hands‑on with pre‑silicon models, simulation tools, and verification environments to ensure functional correctness, performance, and power efficiency.Your responsibilities may include:<ul><li>Performing functional verification of CPU logic to ensure the design meets specification requirements.</li><li>Developing verification plans and test benches, and building verification environments aligned with CPU microarchitecture specifications.</li><li>Executing verification plans and running system-level simulations to verify functionality, characterize performance, and uncover design issues.</li><li>Debugging presilicon failures, including reproducing issues, identifying root causes, and partnering with design teams to drive fixes.</li><li>Improving verification infrastructure, tools, automation, and methodology for ongoing CPU development.</li><li>Documenting test plans, results, and technical findings, and participating in reviews with design and architecture teams.</li></ul>What We’re Looking For (Behavioral Traits):<ul><li>Strong technical problem‑solving skills.</li><li>Collaborate with engineers across multiple teams.</li><li>Multitask and work through ambiguity.</li><li>Clear, concise communication in both written and verbal form.</li></ul>Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.  See  <a href="https://www.intel.com/content/www/us/en/jobs/benefits.html" target="_blank">Intel Benefits</a> for more details<h2>Qualifications:</h2>You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research, and relevant previous job and/or internship experience. Note: For information on Intel’s immigration sponsorship guidelines, please see <a href="https://www.intel.com/content/www/us/en/jobs/hiring.html" target="_blank">Intel U.S. Immigration Sponsorship Information</a>Minimum Qualifications and Experience:The candidate must have a Bachelor&#39;s degree in Electrical/Computer Engineering or any related field.You must have 3&#43; months of educational or work experience in the following:<ul><li>Digital logic design and computer architecture</li><li>At least one scripting language (Python, Perl, or Tcl)</li><li>C&#43;&#43;  and  SystemVerilog</li></ul>Preferred Qualifications and Experience:• Use of AI agents in your projects, college classes, or software development. • Experience with RTL development and debug • Experience with x86 or any other computer architectures • ASM skills • Version control software (GIT). • Experience with Synopsys simulatorsWe are looking for individuals who are passionate about engineering excellence and sustainability. Apply today to help drive Intel&#39;s global impact through innovative.          <h2>Job Type:</h2>College Grad<h2>Shift:</h2>Shift 1 (United States of America)<h2>Primary Location:&nbsp;</h2>US, Texas, Austin<h2>Additional Locations:</h2>US, Oregon, Hillsboro<h2>Business group:</h2>Silicon and Platform Engineering Group (SPE): Deliver breakthrough silicon and platform solutions that deliver industry-leading products today while also defining the next generation of computing experiences.<h2>Posting Statement:</h2>All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.<h2></h2><h2>Position of Trust</h2>N/A<h2>Benefits</h2>We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the <a target="_blank" href="https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003">benefits of working at Intel</a>.   Annual Salary Range for jobs which could be performed in the US: $91,150.00-128,690.00 USD  The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.  Work Model for this RoleThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Junior CPU Design Verification Engineer

CPU Design Verification Engineer

Bachelor's in Electrical/Computer Engineering or related field; 3+ months in digital logic, scripting (Python, Perl, Tcl), C++ and SystemVerilog; preferred: RTL, AI agents, Git, Synopsys simulators; sponsorship info.

<h1>Job Details:</h1><h2>Job Description:&nbsp;</h2>As an integral part of Intel&#39;s new Integrated Device Manufacturer 2.0 (IDM2.0) strategy, we are establishing Foundry Services (FS), a fully vertical, stand-alone foundry business, reporting directly to the CEO. Foundry Services will be a world-class foundry business and major provider of US and European based capacity to serve customers globally. Foundry Services will be differentiated from other foundries with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP&#39;s, along with Arm and RISC-V ecosystem IPs. Foundry Services will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages. Silicon packaging engineering responsibilities include: Drives end-to-end development for mask and panel design from concept through tape out for a given package to produce within the substrate factory. Implements physical layout and routing of the panel design and may help with routing the package. Performs panel substrate fit studies to establish design, performance, and cost tradeoffs. Conducts internal and external reviews, analyzes data, and resolves DRCs to optimize panel design. Completes documentation and collateral into the product lifecycle management system of record.<h2>Qualifications:</h2>You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications:<ul><li>Bachelor’s degree in electrical engineering or related field with 6&#43; months of relevant experience.</li></ul><h3></h3><h3>Relevant experience must include at least one of the following areas:</h3><h3> Valor, Cadence APD, Siemens Xpedition, or CAD software, and readiness to troubleshoot a wide variety of physical design/layout issues. Prior experience with physical layout aspects of substrate design/layout including but not limited to custom layouts, floor plans, or schematic layout conversion.</h3> Preferred Qualifications:<ul><li>Performing panel routing starting day one.</li><li>Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions.</li><li>Microelectronic package substrate technology development.</li><li>Scripting using Python, VB, C, and/or other language</li></ul>          <h2>Job Type:</h2>College Grad<h2>Shift:</h2>Shift 1 (United States of America)<h2>Primary Location:&nbsp;</h2>US, Arizona, Phoenix<h2>Additional Locations:</h2>US, Oregon, Hillsboro<h2>Business group:</h2>Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.<h2>Posting Statement:</h2>All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.<h2></h2><h2>Position of Trust</h2>N/A<h2>Benefits</h2>We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the <a target="_blank" href="https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003">benefits of working at Intel</a>.   Annual Salary Range for jobs which could be performed in the US: $91,150.00-128,690.00 USD  The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.  Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Silicon Packaging Design Engineer

Bachelor’s in electrical engineering with 6+ months of packaging design experience; familiarity with panel/substrate design, DRCs, and design tools; experience with Valor, Cadence APD, Siemens Xpedition; scripting a plus.

ASSOCIATE SOFTWARE CONTROLS ENGINEER At Andrews Cooper, we specialize in delivering cutting-edge engineering solutions in the HardTech space, partnering with industry leaders in Consumer Technology, Medical Technology, Clean Technology, and Automation &amp; Robotics. With a mission to solve novel, ambiguous challenges, we help our customers achieve significant differentiation and success in their industries. Our people-first culture is built on the core values of Own It, Help Each Other Win, and Be Cool, creating an environment where engineers can build fulfilling careers while delivering exceptional work. The Core Values we embody: <ul><li style="margin-left:8px;">Help Each Other Win&#8212;AC values winning as a team over personal recognition. Go out of your way to help a teammate and the team succeed.</li><li style="margin-left:8px;">Own It&#8212;Don&#8217;t wait for someone else to clear the way. Recognize opportunities to improve, and when obstacles arise, join forces to overcome them.</li><li style="margin-left:8px;">Be Cool&#8212;Be self-aware, maintain a positive attitude, prioritize emotional intelligence, and maintain composure under pressure.</li></ul>If you&#8217;re passionate about solving complex engineering problems, collaborating with forward-thinking teams, and making an impact in the world of Hardware Technology, Andrews Cooper is the place for you. BASIC QUALIFICATIONS:<ul><li>B.S. in Software or Electrical Engineering from an accredited university or equivalent experience in a related field. MSEE is a plus.</li><li>2+ years of professional hands-on Software Controls Engineering designing complex automated systems.</li><li>Up to 20% of travel may be required between locations.</li><li>Ability to travel for work-related purposes as needed; access to reliable transportation is required due to the nature of our business and multiple client sites.</li><li>Must be legally authorized to work in the U.S. without sponsorship.</li><li>Background checks are required.</li></ul> PREFERRED QUALIFICATIONS:<ul><li>Programming, using a wide variety of languages and platforms such as LabVIEW, Python, VBA, VB, C (C, C++, C#), Java.</li><li>Possesses a high level of proficiency and expertise in several of these environments:<ul style="list-style-type:circle;"><li>HMI &#8211; Rockwell, Siemens, Codesys (Beckhoff, B&amp;R, Bosch). Maple Systems, Wonderware, Inductive Automation Ignition.</li><li>Industrial Robotics &#8211; Fanuc, Epson, Denso, ABB.</li><li>CAD &#8211; AutoCAD Electrical, Solidworks Electrical, EPLAN.</li></ul></li><li>Familiarity with Virtual Machines, Linux, embedded systems.</li></ul> RESPONSIBILITIES:<ul style="margin-bottom:11px;"><li>Identify and integrate off-the-shelf components including controllers, pneumatics, fluidics, robots, vision systems, motion systems, sensors, part handling systems, safety systems, and conveyors.</li><li>Validate solutions through engineering analysis and calculations.</li><li>Power up and troubleshoot automation systems during startup phases.</li><li>Ability to provide design directions and lead multiple engineers in projects.</li><li>Assist in proposal writing by providing design concepts, labor and material estimates, and scheduling.</li><li>Develop and maintain comprehensive software project planning documentation including detailed machine control specifications, state machine diagrams and task register for tracking and managing project software activities.</li></ul> Why join the Andrews Cooper team? This is a full-time position with compensation, benefits, and work positives, including:<ul><li>Medical, dental, life, and disability insurance; health savings accounts (HSA), flexible spending accounts (FSA), employee assistance programs (EAP), and dependent savings accounts (DSA). </li><li>Paid leave for maternity and paternity for birth or adoption. </li><li>Generous PTO for vacation, sick, community service, and 8 paid holidays. </li><li>In-office snacks, coffee, and sponsored lunches. </li><li>401k retirement plan with 3% employer contribution.</li><li>Access to hands-on mentorship to advance professional skills and an educational reimbursement. </li></ul> The salary range for this position is based on national rates. Exact compensation may vary based on skills, experience, and location. Base Salary: $76,000.00 - $120,000.00. Andrews Cooper is an equal-opportunity employer. &#160;

Associate Software Controls Engineer

B.S. in Software or Electrical Engineering; 2+ years software controls engineering; willing to travel up to 20%; must be legally authorized to work in the U.S. without sponsorship; background checks required.

Senior Structural Modeling &amp; Simulation EngineerDescription -Senior Structural Modeling &amp; Simulation EngineerAt HP, we exist to amaze—through the people we hire, the experiences we enable, the way we treat our customers and each other and ultimately through the technology we create. We invent, develop, and bring to market new technologies and capabilities as well as integrate these technologies into systems. Our focus is on microfluidics technologies based on HP’s long history in print, pursuing broader alternative technologies and research with an eye toward consumer and industrial applications. We provide advanced innovative solutions to our partners and customers, both internal and external.The EMAG (Engineering Modeling and Analysis Group) Expert Structural Modeling Engineer will work as an integral part of our team. You will work with partners to develop and run simulations that uncover fundamental learnings, expedite and inform design cycles, and create insights, leading the organization in a simulation-led design approach. EMAG is responsible for the development and deployment of predictive and diagnostic computational modeling methods in new technology and product development.Responsibilities:You will be responsible for running computational models and writing scripts to simplify processes and improve efficiency. You will work with our group of Fluidic, Thermal and Structural modelers to collaborate with internal development teams to drive design decisions and process development.Required Skills:<ul><li>MS/PHD in Mechanical Engineering, Mathematics, Physics, or related fields</li><li>10&#43; years of demonstrated Finite Element Analysis experience using ABAQUS or equivalent tools, with relevant experience including one or more of:<ul><li>Advanced material properties (Hyperelastic, orthotropic, phase change, etc. . .)</li><li>Solver selection (Explicit, implicit, etc. . .)</li><li>Electronic packaging and submodeling</li><li>MEMS (micro-electro-mechanical systems)</li><li>CTE driven component deformation</li></ul></li><li>5&#43; years of demonstrated HyperMesh experience</li><li>5&#43; years of experience with programming/scripting languages (Python, FORTRAN, C&#43;&#43;, etc. .) to build custom analysis tools and procedures</li><li>Ability to lead a cross-functional team with a simulation-first mindset</li><li>Demonstrated experience using experimental and FEA best practices to validate simulation results to improve trust in models.</li><li>Ability to work effectively on a globally distributed team</li><li>Strong project management skills</li><li>Strong analytical and problem-solving skills</li><li>Eager, quick learner with strong spirit of team-work</li><li>Excellent oral and written English communication skills</li></ul>Desired Skills:<ul><li>Knowledge of materials engineering and experience in material characterization for FEA</li><li>Experience solving in frequency and time domains</li><li>Experience with optimizing simulation setup for high performance computing clusters</li><li>Knowledge of optimization tools and techniques including topology optimization</li><li>Experience with data manipulation</li><li>Leadership and mentoring experience</li></ul>The pay range for this role is $116,150.00 to $182,400.00 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.Benefits:HP offers a comprehensive benefits package for this position, including: * Health insurance  * Dental insurance  * Vision insurance  * Long term/short term disability insurance  * Employee assistance program  * Flexible spending account  * Life insurance  * Generous time off policies, including;  * 4-12 weeks fully paid parental leave based on tenure  * 11 paid holidays  * Additional flexible paid vacation and sick leave (US benefits overview    [https://hpbenefits.ce.alight.com/]) The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.Job -EngineeringSchedule -Full timeShift -No shift premium (United States of America)Travel -Not SpecifiedRelocation -YesEqual Opportunity Employer (EEO) - HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.For more information, review HP’s <a href="https://www8.hp.com/h20195/v2/GetDocument.aspx?docname&#61;c08129225" target="_blank">EEO Policy</a> or read about your rights as an applicant under the law here: “<a href="http://www.eeoc.gov/sites/default/files/2023-06/22-088_EEOC_KnowYourRights6.12ScreenRdr.pdf" target="_blank">Know Your Rights: Workplace Discrimination is Illegal</a>&#34;

Senior Structural Modeling & Simulation Engineer

Structural Modeling & Simulation Engineer

MS/PhD in Mechanical Engineering, Mathematics, Physics, or related field; 10+ years FEA (ABAQUS or equivalent); 5+ years HyperMesh; 5+ years programming/scripting; leadership in cross-functional teams; strong communication.

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